πΈ We are at the πππππ ππππππππππ ππππ!
We are excited to share a glimpse of our ππ¨π¨ππ‘ ππ¨. πππ at the ongoing 20th World Conference on Non-Destructive Testing in Incheon, South Korea.
π Be part of this prestigious 20th World Conference on Non-Destructive Testing, where you’ll witness the latest advancements in Non-Destructive Testing (NDT) solutions and cutting-edge technologies.
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πππ―π ππ‘π ππππ: May 27th to May 31st, 2024
π ππ¨ππππ’π¨π§: Booth No. A51, Songdo Convensia, Incheon, Korea
Experience the latest products from Electronic & Engineering Company India Private Limited () including the Ultrasonic Flaw detector ( EECI), Thickness measurement devices ( Ds702), Magnetic particle inspection instruments ( ETM5), Area Gamma Monitor ( EF9y), and more. AGM
Our esteemed team of experts will lead these demonstrations, showcasing how our groundbreaking products are revolutionizing NDT inspections.
Don’t miss the chance to attend live demonstrations of cutting-edge NDT products. Visit our booth No. A51 and explore the future of NDT! π‘